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GXSC ADC AD7982 Applied in High-Precision Data Acquisition Cards

Time:2026-06-05 Views:314
High-precision data acquisition cards primarily consist of an analog signal conditioning unit, an analog-to-digital conversion unit, a timing control unit, and a data buffer and host computer interface unit. External continuously varying analog sensor signals and voltage signals are precisely conditioned, impedance-matched, and filtered to reduce noise by the front-end operational amplifier before being fed into a high-precision ADC to complete the analog-to-digital quantization conversion; These cards are widely used in mechanical testing, industrial DAQ acquisition, precision instruments, and low-frequency transient signal capture.

The analog-to-digital converter performs high-speed, high-fidelity digital conversion of weak and precision analog signals. The GXSC 18-bit 1 MSPS differential-input ADC is specifically designed for high-precision and low-power applications and can directly replace the AD7982 in industrial, medical, and instrumentation applications.

The GXSC ADC integrates a low-power, high-speed, 18-bit sampling ADC and a multifunctional serial interface. At the rising edge of CNV, the CM2323 samples the voltage difference between the IN+ and IN- pins. The signals on the two input pins are typically out of phase, with a voltage swing ranging from 0V to VREF. The reference voltage VREF is supplied externally and can be independent of the power supply voltage VDD. The total power consumption of the ADC is directly proportional to the sampling rate.

GXSC ADC Product Features
Single-supply operation: 2.5V
Logic interface voltage: 2.5V, 3V, 5V
True differential analog input range: VREF
18-bit resolution, no missing counts, sampling rate: 1 MSPS
INL: Typical value of 1.2 LSB (VREF = 5V)
Dynamic range: 99 dB (VREF = 5 V)
SNR: 98.5 dB (fIN = 1 kHz, VREF = 5 V)
SNDR: 98 dB (fIN = 1 kHz, VREF = 5 V)
THD: -119 dB (fIN = 1 kHz, VREF = 5 V)
Serial Interface: SPI/QSPI/MICROWIRE compatible
No pipeline delay
Low Power Consumption: 8.3 mW (1 MSPS, VDD only); 11.9 mW (1 MSPS, total power); 522 W (10 kSPS, total power)
Package: MSOP10 3mm x 3mm, DFN10 3mm x 3mm

Using the SPI interface’s SDI input pin, multiple ADCs can be daisy-chained together, and an optional busy indicator is provided. With an independent VIO power supply, the chip is compatible with 2.5V, 3V, and 5V logic.