GXSC‘s multifunctional amplitude-phase chip, which replaces the ADMV4680, is widely used in low-Earth orbit (LEO) broadband satellite phased-array user terminals

Low-Earth-orbit (LEO) broadband satellite phased-array user terminals primarily consist of an RF phased-array antenna array, a beamforming RF unit, a main control and processing unit, and a signal transceiver and demodulator unit. The terminal relies on a multi-channel beamforming chip to perform gain adjustment, phase calibration, and beam synthesis for signals across each channel of the antenna array. Through high-speed electronic scanning, it enables real-time acquisition, precise tracking, and seamless switching of high-speed transiting LEO satellites; It performs downlink satellite signal reception and demodulation as well as uplink data modulation and transmission, ultimately enabling high-speed broadband satellite internet access, data transmission, positioning, and communication functions.

GXSC’s amplitude-phase multifunctional chip is a four-channel half-duplex beamforming chip developed specifically for Ku-band LEO satellite communication systems. The chip covers the Ku-band satellite communication receive (10.7–12.7 GHz) and transmit (14–14.5 GHz) frequency bands, precisely matching the mainstream Ku-band used in LEO satellite communications. It requires no additional frequency conversion components and can be directly integrated with the RF front end of LEO satellite user terminals to achieve efficient satellite signal transmission and reception. Its product advantages are as follows:

1. Performance-compatible replacement for the ADMV4680

2. CMOS process, enabling low-cost mass production

3. High transmit and receive gain: ≥25 dB

4. High transmit output power: OP-1d8 power ≥11 dBm

5. Low power consumption

The GXSC multifunctional amplitude-phase chip uses a 4-wire standard SPI interface for register configuration and control, supporting bias adjustment, channel enable/disable control, and transmit/receive switching. Additionally, the single chip features five address pins (ADD0–ADD4) to enable serial control of up to 32 chips in an application. The chip supports internal beam storage, facilitating rapid switching between beam states. The chip is powered by a 1.2V main supply, with digital I0 powered by 3.3V and digital I0 using standard 3.3V CMOS logic.

GXSC Multifunction Amplitude-Phase Chip Performance Specifications:

 Receive: 10.7–12.7 GHz

 Transmit: 14–14.5 GHz

 Receive/Transmit time-division half-duplex

 4T4R RF channels with integrated frequency-division/synthesis networks

 360° range phase control / 6-bit / LSB = 5.6°

 31.5 dB range-controlled amplitude modulation / 6-bit / LSB = 0.5 dB

Receive noise figure (NF) approximately 3 dB

Integrated temperature sensor

Integrated quantized ADC

Integrated 4-channel power detector

Integrated beam storage

Transmit/receive state switching via dedicated pin

4-wire SPI control

WLCSP (BGA) surface-mount package

Integrated bias and channel control