XC7K160T/XC7K325T/XC7K410T Replacement: GX1P170 Pin-Compatible High-Performance FPGA

GX1P170 is developed for communication, radar, industrial control, image processing, data-center, test and measurement, and other systems requiring high-density programmable logic, extensive DSP resources and high-speed serial connectivity.

The device integrates 170K logic cells, 11,700 Kb of embedded RAM, eight clock management units and 600 DSP blocks. It supports DDR3 data rates up to 1866 Mb/s and includes one PCIe Gen2 block together with eight SerDes channels operating at up to 12.5 Gb/s.

GX1P170 provides an FC676 hardware migration option for specified XC7K160T-FFG676, XC7K325T-FFG676 and XC7K410T-FFG676 designs. Its resource configuration most closely matches XC7K160T. Migration from XC7K325T or XC7K410T is possible only when the implemented design uses no more than the logic, RAM, DSP, clocking, SerDes and PCIe resources available in GX1P170.

GX1P170 as an XC7K160T, XC7K325T or XC7K410T Hardware Replacement

GX1P170 provides a close resource-level replacement for XC7K160T, offering slightly more logic capacity while matching its embedded RAM, DSP, clock-management and high-speed transceiver counts.

GX1P170 can also provide a hardware migration path for XC7K325T-FFG676 and XC7K410T-FFG676 products when the actual implemented design fits within the GX1P170 resource limits.

Because XC7K325T and XC7K410T contain substantially more logic cells, embedded RAM, DSP blocks and SerDes channels, GX1P170 should not be described as a full-capacity replacement for every design based on these devices. The existing utilization report and interface configuration must be reviewed before migration.

For new products, GX1P170 can be evaluated as a high-performance FPGA platform for real-time signal processing, high-speed communication, image and video processing, industrial automation and PCIe-connected equipment.

FC676 Pin-Compatible Hardware Migration Conditions

GX1P170 is offered in an FC676 package measuring 27 mm × 27 mm with a 1.0 mm ball pitch. It is designed to support pin-compatible hardware migration from specified XC7K160T-FFG676, XC7K325T-FFG676 and XC7K410T-FFG676 configurations.

When the complete ball map, power architecture and interface assignments are compatible, the existing schematic and PCB layout can potentially be retained.

The GX1P170 core voltage is 0.9 V for the standard version and 0.85 V for the low-power version. The corresponding Kintex-7 devices commonly use a nominal 1.0 V core supply, with selected low-power versions operating at 0.9 V. The existing core-voltage regulator must therefore be checked and may require modification.

Pin compatibility does not mean that the original FPGA bitstream can be used directly. HDL code, IP cores and constraints must be migrated to the GXSC-supported development environment and then resynthesized, placed and routed, timing-verified and regenerated as a GX1P170 configuration file.

Before completing a migration, engineers should verify:

l Complete FC676 and FFG676 ball-map correspondence

l Actual logic, embedded RAM and DSP utilization

l Clock-management resource usage

l Number and placement of active SerDes channels

l SerDes line rate, reference clocks and signal integrity

l PCIe generation, lane width and endpoint configuration

l DDR3 pin assignments, memory topology and timing

l Core, auxiliary, transceiver and I/O-bank supply voltages

l Power-up and power-down sequencing

l Configuration interface and boot memory

l Speed grade and junction-temperature requirements

l Thermal design and package assembly conditions

GX1P170 vs XC7K160T, XC7K325T and XC7K410T: Key Specification Comparison

GX1P170 closely matches the main resource configuration of XC7K160T. For XC7K325T and XC7K410T replacement projects, compatibility depends on whether the implemented design fits within the lower GX1P170 resource capacity and uses no more than eight SerDes channels.

Logic, DSP, Memory and High-Speed Serial Resources

Key GX1P170 features include:

l 170K logic cells

l 11,700 Kb of embedded RAM

l Eight clock management units

l 600 DSP blocks

l DDR3 data rates up to 1866 Mb/s

l One integrated PCIe Gen2 block

l Eight SerDes channels operating at up to 12.5 Gb/s

l 0.9 V standard core voltage

l 0.85 V low-power core-voltage option

l Commercial junction-temperature range of 0°C to 85°C

l Industrial junction-temperature range of −40°C to +105°C

l FC676 package measuring 27 mm × 27 mm

l 1.0 mm ball pitch

These resources make GX1P170 suitable for communication equipment, wireless infrastructure, radar and digital signal processing, industrial control, machine vision, image and video processing, data-center interfaces, test and measurement equipment, high-speed data acquisition and other compute-intensive FPGA applications.

Migration Verification and Technical Support

GXSC can provide technical support for XC7K160T, XC7K325T and XC7K410T replacement projects, including pinout comparison, power-supply review, FPGA resource evaluation, HDL and IP migration, constraint conversion, timing verification, sample testing and system-level validation.

For XC7K325T and XC7K410T projects, customers should provide the existing resource-utilization report so that GXSC can confirm whether the design fits within 170K logic cells, 11,700 Kb of RAM, 600 DSP blocks, eight clock management units and eight SerDes channels.

GXSC can also provide device-selection and development support for new systems based on GX1P170.

Request the GX1P170 Datasheet, Samples and Migration Support

Contact GXSC to request the GX1P170 datasheet, FC676 package and pinout information, development tools, samples, quotation or technical support.

For replacement evaluation, please provide the complete XC7K160T-FFG676, XC7K325T-FFG676 or XC7K410T-FFG676 ordering code, speed grade, temperature grade, power configuration, pin constraints and FPGA resource-utilization report.