XC7A35T/XC7A50T/XC7A75T/XC7A100T/XC7A200T Replacement: GX1P110 Package-Specific Pin-Compatible FPGA

GX1P110 is designed for industrial control, communication, image and video processing, medical equipment, automotive electronics, data-center interfaces and other applications requiring programmable logic, embedded memory, DSP processing and high-speed connectivity.

The device integrates 110K logic cells, 4,860 Kb of embedded RAM, six clock management units and 240 DSP blocks. It supports DDR3 data rates up to 1066 Mb/s and includes one PCIe Gen2 block. Depending on the selected package, GX1P110 provides up to 300 user I/Os and eight SerDes channels operating at up to 6.6 Gb/s.

GX1P110 provides package-specific pin-compatible hardware migration options for selected Artix-7 devices. The resource configuration closely matches XC7A100T and exceeds the principal logic, RAM and DSP resources of XC7A35T, XC7A50T and XC7A75T. Replacement of XC7A200T is conditional because GX1P110 has fewer logic cells, RAM blocks, DSP blocks, clock resources and SerDes channels.

GX1P110 as an XC7A35T, XC7A50T, XC7A75T, XC7A100T or XC7A200T Replacement

GX1P110 provides sufficient programmable resources to migrate designs based on XC7A35T, XC7A50T, XC7A75T and XC7A100T, subject to package, pinout, power and interface verification.

Its resource configuration is particularly close to XC7A100T. GX1P110 provides slightly more logic capacity while matching XC7A100T in embedded RAM, clock-management units and DSP blocks.

GX1P110 can also be evaluated for XC7A200T replacement projects when the implemented design uses no more than 110K logic cells, 4,860 Kb of embedded RAM, six clock management units, 240 DSP blocks and eight SerDes channels.

Because XC7A200T contains 215,360 logic cells, 13,140 Kb of RAM, ten clock management tiles, 740 DSP slices and 16 device-level GTP transceivers, GX1P110 is not a full-capacity replacement for every XC7A200T design. The existing utilization report must be reviewed before migration.

For new product development, GX1P110 provides a scalable FPGA platform with three package options for systems requiring different I/O and high-speed serial interface configurations.

Package-Specific Pin-to-Pin Hardware Compatibility

GX1P110 is available in FC324, FC484 and FC676 packages. The supported replacement models, I/O counts and SerDes resources depend on the selected package.

For bidirectional migration between GX1P110-FC484 and XC7A35T-FGG484 or XC7A50T-FGG484, the 35 additional GX1P110 I/Os in Bank 13 should remain unused.

The FC324 version does not provide bonded SerDes channels. Designs requiring PCIe or other transceiver-based interfaces must use an appropriate FC484 or FC676 configuration and verify the required lane placement.

The GX1P110 core voltage is 0.9 V for the standard version and 0.85 V for the low-power version. Artix-7 devices are available with different core-voltage options depending on speed and power grade. The existing VCCINT and related power rails must therefore be checked and may require modification.

Pin compatibility refers to the approved package and ball-map arrangement. It does not mean that an existing configuration bitstream can be programmed directly into GX1P110. FPGA logic, IP, constraints and configuration files must be migrated and regenerated using the GXSC-supported development flow.

GX1P110 vs XC7A35T, XC7A50T, XC7A75T, XC7A100T and XC7A200T

GX1P110 provides sufficient resources for the principal XC7A35T, XC7A50T, XC7A75T and XC7A100T configurations. XC7A200T replacement depends on actual resource utilization, package pin use and the number of required SerDes and I/O channels.

Programmable Resources, Package Options and Applications

Key GX1P110 features include:

l 110K logic cells

l 4,860 Kb of embedded RAM

l Six clock management units

l 240 DSP blocks

l DDR3 data rates up to 1066 Mb/s

l One integrated PCIe Gen2 block

l Up to eight SerDes channels operating at 6.6 Gb/s

l 0.9 V standard core voltage

l 0.85 V low-power core-voltage option

l Commercial junction-temperature range of 0°C to 85°C

l Industrial junction-temperature range of −40°C to +105°C

l FC324 package with 210 user I/Os and no SerDes

l FC484 package with 285 user I/Os and four SerDes channels

l FC676 package with 300 user I/Os and eight SerDes channels

GX1P110 is suitable for industrial control systems, communication equipment, machine vision, image and video processing, medical equipment, automotive electronics, data-center interfaces, test and measurement systems, high-speed data acquisition and other programmable-logic applications.

Migration Verification and Technical Support

GXSC can support XC7A35T, XC7A50T, XC7A75T, XC7A100T and XC7A200T replacement projects with package selection, ball-map comparison, I/O-bank review, power-supply verification, resource evaluation, HDL and IP migration, constraint conversion, timing verification and sample testing.

Before approving a replacement, engineers should verify:

l Complete source-device ordering code

l Target GX1P110 package and pinout version

l Logic, RAM, DSP and clock-resource utilization

l I/O-bank assignments and voltage standards

l Use of Bank 13 in FC484 migration projects

l Use of the 100 NC pins in XC7A200T-FBG676 migration projects

l SerDes channel count, placement and reference clocks

l PCIe generation, lane width and reset architecture

l DDR3 memory topology and timing

l Core, auxiliary, transceiver and I/O supply voltages

l Configuration memory and boot interface

l Speed grade and operating-temperature requirements

l Thermal and mechanical assembly conditions

Request the GX1P110 Datasheet, Samples and Migration Support

Contact GXSC to request the GX1P110 datasheet, package-specific pinout files, development tools, samples, quotation or technical support.

For replacement evaluation, please provide the complete XC7A35T, XC7A50T, XC7A75T, XC7A100T or XC7A200T ordering code, existing package, speed grade, temperature grade, pin constraints and FPGA resource-utilization report.